Quality Laboratory

1. Mature quality control system:Strictly screen high-quality original manufacturers or agents related channels, conduct hierarchical and classified management, and conduct different levels of inspections for incoming goods to ensure that they are from the source.You can control risks by going up.

2. Quality Control Laboratory:A total of nearly 10 million self-built high-standard quality control laboratories have been obtained through professional equipment, technology, and database establishment.CMA、CNASCertification, based on industry inspection standards, provides component anti-counterfeiting, failure analysis, reliability testing and other inspection items.

3. Complete inspection of incoming materials grading:To ensure that the quality of the material meets the highest standards, all incoming materials must pass the laboratory IQC strict inspection and pass before they can be put into the warehouse.Our testing process fully complies with international authoritative standards such as AS6081, GJB-548C, MIL-STD-883, J-STD and AEC Q100, and each test result must be professionally compared and verified with the original gold sample data to ensure the accuracy and reliability of the judgment results.

4. Intelligent miss-proof detection system:The laboratory inspection process is online, and it has an intelligent system to prevent missed inspection. It controls the quality of materials at all levels, and does not miss every detail to ensure zero defects in the product.

5. Establish a catalog of high-risk categories:By analyzing and testing data, establishing a catalog of high-risk categories and constantly updating it, we can effectively guide our procurement, which ones should be purchased and what should not be purchased, to avoid the risk of abnormal quality.

6. Professional technical team:With an experienced technical team, we formulate standardized RMA processes, and can provide customers with on-sales and after-sales technical support at any time.

7. Establish warehouse quality management standards:We have established quality management standards for warehouses, standardized management of collection, delivery, storage and other processes, and good quality internal control.

What testing items can we provide?

Provide you with professional inspection services such as component anti-counterfeiting verification, failure analysis, reliability testing, etc.

Appearance detection

it is mainly used for authenticity identification, dpa testing, to detect whether the material has been renovated, polished, coating, reprinted, defects and other issues, authenticity of the label, whether the packaging is intact, and whether the dimensions meet the specifications.the standards based on are as6081 and mil-std-883.

X-RAY detection

Detect the material for quality defects, such as cavity, impurities, silver paste climbing height, line arc and other abnormalities. It can also be used for authenticity identification, and the differences can be confirmed through the comparison of gold samples, the internal structure, bonding lines, and round sizes.The standards based on are MIL-STD-883 and GJB-548C.

Open cover test

Detect the wafer information of the material, such as wafer size, logo information, wafer code, and surface wiring, and determine the authenticity by comparing it with the gold sample. At the same time, quality inspection can be carried out to check whether there are any damages, cracks, and whether the binding line meets the requirements.The standards based on are MIL-STD-883 and GJB-548C.

Solderability test

It is mainly used to detect the tin-loading ability of materials. Chips with good solderability are easier to combine with solder during soldering to verify whether there is a risk of abnormal soldering (such as missing soldering, false soldering, and refusal of soldering). At this stage, the appearance impregnation method is used to test.The standard based on is J-STD.

Slice test

It is mainly used for the authenticity detection (resistance and capacity sensing) of passive devices. It can confirm the authenticity by comparing the internal structure with the gold sample. For example, the capacitor mainly depends on the number of electrode layers, electrode layer thickness, protective layer thickness, and dielectric layer thickness; the inductance mainly depends on the number of coil turns, line diameter, line mode, and whether there is a magnetic core. Secondly, failure analysis requires the use of slice tests to slice the material in a fixed point.The standard based on is GB/T 4677-2002.

Functional testing

Through the reference circuit and testing conditions given by the specifications or official website, the circuit is built, and the functional parameters of the material meet the specification requirements and verify whether the material can be used normally.The standard based on is GJB-128B.

Electrical characteristics test

According to the original specifications, test whether the key performance of the material meets the standards. Use a semiconductor crystal characteristic diagram instrument and I/V curve tester to check whether the re-check sample has problems such as open circuit, short circuit, and abnormal impedance through open circuit tests to confirm the product's failure mode.The standard based on is MIL-STD-883L-2019 3005.1.

Programming and burning

Part of the performance test, the process of loading specific program code or data into integrated circuit chips (usually microcontrollers or memory chips) is mainly aimed at whether MCUs and memory chips can be programmed and recorded normally.The standard based on is GJB-128B.

Aging test

Predict the service life of the product, evaluate or predict the durability of the product produced by the manufacturer, remove failed products, and avoid waste of packaging costs.

Super-generation scanning

Ultrasonic scanning can be used to detect structural defects such as layering, cracks, air holes, etc. at different locations inside the chip. It is one of the important analysis methods for non-destructive analysis in failure analysis, and it is also one of the important detection methods for detecting quality problems in reliability projects.

Scanning electron microscope

Scanning electron microscopy is a method of scanning the sample surface using a focused electron beam. By detecting the signals generated by electrons acting on the sample, it observes and analyzes the composition, morphology and structure of the sample surface. It mainly analyzes the surface characteristics of the sample through secondary electrons, backscattered electrons and characteristic X-ray signals.

Failure analysis

Failure analysis is a systematic study of failed/failed components through professional technical means, mainly analyzing the specific reasons for failure of electronic parts and components in operation, analyzing why they cannot meet performance expectations, and their potential performance in expected end uses.Such as PCBA solder joint cracking, chip burning, circuit short circuit, etc.